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inspection machine, marking machine, cleaning systems - Insertion & Assembly : insertion machine, soldering machine (wave/selective), assembly robots, test equipment - Semiconductor Packaging : semiconductor packaging materials & parts...

부무 Selective Coating 장비 보급으로 보다 정밀하고 생산성있는 구도로 변화 되었습니다. 이로인하여 보다 고 품질의 Curning 중요한 공정 중에 하나 입니다 건조 공중 중에 기포가 들어가면 않도며, 이러한 기포 없이 Reflow 건조를 위하여 온도/UV/Hot...

and soldering, which do not melt the base metal. In addition to melting the base metal, a filler material is typically added to the joint to form a pool of molten material (the weld pool) that cools to form a joint that is usually...

The technique comprises the overall plating (non-selective) of the Cu alloy leadframe with Ni and Pd. The Pd-deposit...barrier for the underlying Ni, which is the actual bonding / soldering surface. In recent years, a thin gold flash...